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| Mfr Part # | Quantity Available | Price | Rohs Status | Reach Status | Mounting type |
|---|---|---|---|---|---|
|
TOP257GN-TL
Power Integrations
|
1,617 In Stock | 1 : $ Box | ROHS3 Compliant | Surface Mount | |
|
TOP257MN
Power Integrations
|
1 : $ Box | RoHS Compliant | Through Hole | ||
|
TOP257YN
Power Integrations
|
1,491 In Stock | 1 : $ Box | ROHS3 Compliant | Through Hole | |
|
TOP258PN
Power Integrations
|
13,480 In Stock | 1 : $ Box | ROHS3 Compliant | Through Hole | |
|
TOP258GN-TL
Power Integrations
|
2,553 In Stock | 1 : $ Box | ROHS3 Compliant | Surface Mount | |
|
TOP258MN
Power Integrations
|
1 : $ Box | RoHS Compliant | Through Hole | ||
|
TOP258YN
Power Integrations
|
3,443 In Stock | 1 : $ Box | ROHS3 Compliant | Through Hole | |
|
BM2P101E-Z
Rohm Semiconductor
|
2,000 In Stock | 1 : $ Box | ROHS3 Compliant | Through Hole | |
|
HFC0100HS-LF-P
Monolithic Power Systems Inc.
|
8 In Stock | 1 : $ Box | ROHS3 Compliant | Surface Mount | |
|
FSQ0170RNA
onsemi
|
1 : $ Box | ROHS3 Compliant | Through Hole | ||
|
FSQ0270RNA
onsemi
|
1 : $ Box | ROHS3 Compliant | Through Hole | ||
|
FSQ0370RNA
onsemi
|
1 : $ Box | ROHS3 Compliant | Through Hole | ||
|
BM2PDB1Y-Z
Rohm Semiconductor
|
1,000 In Stock | 1 : $ Box | ROHS3 Compliant | Through Hole | |
|
BM2P0361K-Z
Rohm Semiconductor
|
1,996 In Stock | 1 : $ Box | ROHS3 Compliant | Through Hole | |
|
BM2PDA1Y-Z
Rohm Semiconductor
|
1,998 In Stock | 1 : $ Box | ROHS3 Compliant | Through Hole | |
|
BM2PAA1Y-Z
Rohm Semiconductor
|
1,865 In Stock | 1 : $ Box | ROHS3 Compliant | Through Hole | |
|
LYT4312E2
Power Integrations
|
1 : $ Box | Through Hole | |||
|
TOP254GN
Power Integrations
|
1 : $ Box | RoHS Compliant | Surface Mount | ||
|
TOP255GN
Power Integrations
|
1 : $ Box | RoHS Compliant | Surface Mount | ||
|
TOP256GN
Power Integrations
|
1 : $ Box | RoHS Compliant | Surface Mount |
ARINC Inserts
ARINC connectors are based on standards developed by Aeronautical Radio Incorporated for aviation electronics and similar applications requiring high-reliability, blind-mating interconnect systems to enable rapid in-field replacement of faulty equipment. They are modular or configurable in character, allowing various configurations of electrical and fiber optic contact inserts to be assembled into standardized frames in order to construct a connector suited to a particular need.
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